1 Introduction
In the LED industry structure, the packaging and application are located in the middle and lower reaches of the industry chain, completing the conversion of LED products from chips to Diodes and devices (DeviceorComponents) and finally implementing lighting applications. LED products are used as semiconductor illumination sources. Really enter the market and replace the direct link of traditional lighting sources.
Due to the relatively backward development start time, China's LED semiconductor lighting industry is also subject to foreign patents or products such as high-performance accessories in the packaging and application industries. Compared with upstream, due to the lack of first-hand technology and core intellectual property rights in chip research, raw materials, growth equipment, etc., and the foreign technology blockade, the independent innovation and patent applications in the middle and lower reaches are at the same starting line as foreign countries. Due to China's innate characteristics as a large exporting country of traditional lighting products and related industries, the industrial scale in LED packaging and application is at the international leading level. According to statistics, China's LED lighting applications account for more than 60% of the world's production, has become a global manufacturing base for LED lighting products.
However, as the middle and lower reaches of the LED industry, on the one hand, it is still restricted by foreign core products and patents in the upstream and materials fields. On the other hand, the scale of enterprises is small, the industrial concentration is low, and the phenomenon of repeated low-level investment construction is also serious, and the market competition is disorderly. At the same time, the construction of relevant industry standards, testing and certification systems still needs to be strengthened, and the service support system needs to be improved.
As a new lighting technology, semiconductor lighting is still in a period of continuous development, and the technical level and indicators are still being refreshed. Under such a background, we must adhere to technological innovation, break through foreign patent blockades, strengthen the development of new technologies, new materials and new products, cultivate core products with independent intellectual property rights and strong competitiveness, optimize industrial structure, and establish markets. Demand-oriented, LED industry with industry leading enterprises as the backbone, strengthen macro guidance for industrial development, form policies and supporting environment conducive to industrial development, give full play to the basic role of market allocation resources, standardize market competition behavior, and realize China's LED lighting products The quality has reached the international advanced level and truly realizes the blueprint of LED semiconductor lighting.
2. Package
1 Overview
LED packaging technology draws on discrete device packaging technology, and has a special feature, in addition to the conventional electrical interconnection and mechanical protection to ensure the normal operation of the die, while emphasizing optical and thermal design innovation and technical requirements. . Especially with the maturity of LED chip technology, the trend of LED power and multi-application fields is becoming more and more obvious, and the requirements for packaging technology are becoming stricter.
The LED package format has evolved from early low-power through-hole packages to surfacemounting device (SMD) packages, high-power packages, and multichipsonboard (MCOB) packages. According to the position at the time of chip packaging, it can also be divided into a package format such as a dressing, a flipchip, or a vertical structure. The LED packaging materials relate to a support, a substrate, a phosphor, a silica gel, a solid crystal glue, a lens, a bond alloy wire (alloy wire), a heat sink and the like.
With the increasing power of LEDs, especially for high-power white light applications, the functions required for LED packaging are clearer and clearer: 1. Die protection, improving the reliability of chip and device operation, enhancing anti-static shock, and resistance Mechanical vibration capacity; 2, strengthen heat dissipation, reduce chip junction temperature, extend chip and phosphor life; 3, optical optimization, achieve spectrum by coating phosphor, improve light extraction efficiency and optimize and achieve specific light distribution; 4, electrical management, Optimize and complete multi-chip serial concatenation, even achieve AC/DC transition or power control.
Rhenium Alloys,Tungsten Rhenium Wire,Rhenium Alloys Composition,Tungsten Rhenium Alloy Density
Shaanxi Xinlong Metal Electro-mechanical Co., Ltd. , https://www.cnxlalloys.com