Japan's three major silicon wafer giants affected by the earthquake announced this week that their plant production resumed better than expected and will restart production in the near future. At present, the trend of tight supply and demand of silicon wafers and rising prices are expected to be eased. However, the impact of the Japanese earthquake on the global semiconductor chip supply chain still exists. The supply of BT resin may be the focus. At present, the three major silicon wafer giants in Japan, including Xinxing, Riyueguang, Jingshuo, and other earthquakes, announced this week that their plant production resumed better than expected and will restart production in the near future. Currently, silicon wafer supply and demand are tense. The trend of rising prices is expected to ease. However, the impact of the Japanese earthquake on the global semiconductor chip supply chain still exists. The supply of BT resin may be the focus. At present, the company's BT resin stocks, including Xinxing, Riyueguang, Jingshuo, etc., are about one month old. Although the two major BT suppliers are currently claiming capacity recovery, they have not yet achieved delivery. The tight supply of BT resin will indirectly affect the supply of consumer electronics including smart phones and calculators by affecting PCBs, substrates and packaging. We believe that with the arrival of the second quarter, the impact of the earthquake in Japan will gradually weaken, and the previously suppressed consumer demand for the terminal is expected to start again and promote the industry to warm up.
Japan's post-disaster recovery production exceeded expectations and the strong earthquake in Japan on March 11, 2001 caused Japan's semiconductor silicon round industry to be severely hit. The three silicon wafer production plants of Shin-Etsu Chemical Shirakawa Plant, SUMCO Yonezawa Plant and MEMC Utsunomiya Plant all stopped production, and more than 25% of the world's silicon wafer production capacity was affected. Before this, the market generally expects that the three factories will gradually resume production and ship in May, but at present, the progress of the resumption of production at the three factories is better than expected.
Semiconductor silicon faucet Shin-Etsu Chemical announced on April 11 that the “White River Factoryâ€, the largest silicon wafer production plant in Fukushima Prefecture in northern Japan, is currently conducting equipment inspection and repair operations, and is expected to restart production in the near future. , and has now shipped for the inventory manufactured before the 311 strong earthquake occurred. According to the Nikkei report, some production lines at the Baihe plant are expected to restart production within 1-2 weeks. SUMCO, the second largest silicon wafer manufacturer, announced on April 12 the progress of the factory resumption. Some production lines of the Yonezawa factory that were suspended due to the impact of the strong earthquake have restarted production due to the completion of safety and production quality confirmation. Kyushu Island Plant instead of production. According to the Nikkei news report, the Yonezawa factory mainly produces the most advanced 12-inch semiconductor silicon wafers, and its output accounts for 3-40% of SUMCO's overall 12-inch silicon wafers. Another large silicon wafer manufacturer MEMC announced on the 12th that a 12-inch silicon wafer factory in Utsunomiya, Japan, resumed production and shipments were no longer flawless, and the yield rate of finished products was up to the level before the 311 earthquake. In addition, the raw materials were flawless and the power supply was also improved. MEMC said that the 12-inch silicon fab production is scheduled to fully recover in mid-May, and that the company's 8-inch wafer production capacity will be transferred to Ipoh in Malaysia ahead of schedule (targeted for completion in the third quarter of this year).
In the short term, due to the active stocking of large manufacturers and the effect of agents picking up goods, the increase in silicon wafer prices in the second quarter is inevitable. However, with the next 2-3 months, the production capacity of silicon wafer manufacturers will gradually return to the pre-earthquake level, while the major semiconductor manufacturers in Taiwan still have 1.5 to 2 months of inventory at the end of the first quarter, so the supply and demand situation of silicon wafers may be Slow down.
However, compared with silicon wafers, the smooth availability of BT resin has become another focus of the market. There is a possibility of shortage of BT resin for the carrier board. At present, about 90% of BT resins in the world come from Hitachi Chemical and Mitsubishi Gas Chemical. Although the two companies have announced a timetable for resumption of work, Hitachi will resume 80% of its capacity supply before mid-April; Mitsubishi expects to resume 50% of production capacity by the end of April. At the beginning of May, BT resin materials will resume production before the earthquake. ability. However, due to supply constraints, the actual supply of raw materials is uncertain. At present, the company's BT resin stocks, including Xinxing, Riyueguang, Jingshuo, etc., are about one month old.
Although the two major BT suppliers are currently claiming capacity recovery, they have not achieved delivery yet, and it is not known whether there will be any change in the later period. The tight supply of BT resin will indirectly affect the supply of consumer electronics including smart phones and calculators by affecting PCBs, substrates and packaging.
Due to the disruption of the customer supply chain by strong earthquakes in Japan, the hesitation of certain customers' attitudes to orders has affected the entire semiconductor industry chain to a certain extent, leaving the “aftershocks†of the semiconductor industry chain surviving. The wafer tester Jingyuan inductance was affected by the customer's impact. Orders tend to be conservative, affecting the company's overall demand in the second quarter is not as expected; at the same time LCD driver IC and mobile phone chip design customers face lack of material situation, affecting the company's drive IC and mobile phone chip packaging test business.
In addition, TSMC’s equipment purchased from TEL cannot find other sources of procurement. For TSMC, which has orders for subcontract manufacturing OEMs next year, it will not be able to expand production capacity as scheduled. The impact.
In general, more than 30 devices and 19 materials are required to produce semiconductor chips. As long as one device or one material cannot be supplied, the semiconductor chip cannot be manufactured. The overall share of Japan for semiconductor production equipment is 37%. Judging from the share of each device, Japan has 10 kinds of market monopoly equipment with more than 50% share. From the materials perspective, the overall share of semiconductor materials in Japan exceeds 66%. Semiconductor manufacturers such as the United States, Europe, South Korea, and Taiwan, China use semiconductor production equipment in Japan, which accounts for 37% of the world's total, and semiconductor materials in Japan, which account for more than 66% of the world's share, and produce about 80% of the world's semiconductor chips.
Looking at the aftershocks of the Japanese semiconductor supply chain will also have an impact on the global semiconductor industry. Therefore, it is expected that the global semiconductor growth rate in the second quarter of 2011 will still be lower than expected. However, considering that the electronics industry's industrial chain has a strong self-repair and adjustment, after entering the second quarter, the impact of Japan's earthquake will tend to weaken, and the previously suppressed consumer demand will once again start to promote the industry warming, with Some structural investment opportunities.
Japan Earthquake Pushes Up Chip Revenue Expectations The latest research from IHS iSuppli, a US market research company, shows that due to the supply chain effect caused by the earthquake and tsunami in Japan pushing up the prices of important storage devices, global semiconductor revenue in 2011 will be higher than earlier expected. According to the latest research from IHSiSuppli, the growth rate of semiconductor revenue in 2011 is expected to reach 7%, which is higher than the 5.8% expected in early February. Global semiconductor revenue in 2011 is expected to reach US$325.2 billion, which was previously estimated at US$322.1 billion. The semiconductor revenue forecast for each quarter in 2011 exceeds the previous forecast. The main reason is that the revenue of DRAM (dynamic random access memory) equipment is expected to increase.
According to a recent study by iSuppli, DRAM revenue is expected to increase by 6.6% in 2011, which is expected to decline by 4% year-on-year, before it was expected to decline by 10.6% year-on-year. The expected increase in DRAM revenue was driven by the increase in the average sales price in the first quarter, which was partly due to the disruption of the supply chain caused by the earthquake. (Source: iSuppli) The Japanese earthquake last month caused tight silicon wafers (DRAM shipments fell 1.1% in March and April global shipments), coupled with recent problems with some DRAM makers experiencing 40nm process yield problems. As PC-OEM manufacturers strengthen their stocks, DRAM contract prices continue to rise. In addition, many DRAM makers have begun to shift some of their DRAM production capacity to NAND Flash products, including SAMSUNG, the industry leader, so DRAM prices have risen unavoidably.
Judging from our domestic situation, during the “Twelfth Five-Year Plan†period, the rapid development of China’s economy and the emergence of strategic emerging industries will provide a broader market and innovation space for the accelerated development of the integrated circuit industry, resulting in multiple levels of integrated circuits. Market demand, domestic IC design industry should seize the opportunity of the development of new industries and achieve greater results.
With the advantage of the world's largest electronics manufacturing industry, China’s share of global semiconductor consumption continues to grow, but the level of semiconductor product design and production in China still lags behind the world’s advanced level. The state has given a series of supportive policies from the level of policy support. For example, the new document No. 18 issued at the beginning of the year clearly stipulates the tax concessions and property protection of IC design companies. At the same time, the domestic IC design companies can better understand the local customers, so they can better complete the customer's local customization requirements. The response speed has obvious advantages, and the domestic IC design companies have a broad development space.
Japan's post-disaster recovery production exceeded expectations and the strong earthquake in Japan on March 11, 2001 caused Japan's semiconductor silicon round industry to be severely hit. The three silicon wafer production plants of Shin-Etsu Chemical Shirakawa Plant, SUMCO Yonezawa Plant and MEMC Utsunomiya Plant all stopped production, and more than 25% of the world's silicon wafer production capacity was affected. Before this, the market generally expects that the three factories will gradually resume production and ship in May, but at present, the progress of the resumption of production at the three factories is better than expected.
Semiconductor silicon faucet Shin-Etsu Chemical announced on April 11 that the “White River Factoryâ€, the largest silicon wafer production plant in Fukushima Prefecture in northern Japan, is currently conducting equipment inspection and repair operations, and is expected to restart production in the near future. , and has now shipped for the inventory manufactured before the 311 strong earthquake occurred. According to the Nikkei report, some production lines at the Baihe plant are expected to restart production within 1-2 weeks. SUMCO, the second largest silicon wafer manufacturer, announced on April 12 the progress of the factory resumption. Some production lines of the Yonezawa factory that were suspended due to the impact of the strong earthquake have restarted production due to the completion of safety and production quality confirmation. Kyushu Island Plant instead of production. According to the Nikkei news report, the Yonezawa factory mainly produces the most advanced 12-inch semiconductor silicon wafers, and its output accounts for 3-40% of SUMCO's overall 12-inch silicon wafers. Another large silicon wafer manufacturer MEMC announced on the 12th that a 12-inch silicon wafer factory in Utsunomiya, Japan, resumed production and shipments were no longer flawless, and the yield rate of finished products was up to the level before the 311 earthquake. In addition, the raw materials were flawless and the power supply was also improved. MEMC said that the 12-inch silicon fab production is scheduled to fully recover in mid-May, and that the company's 8-inch wafer production capacity will be transferred to Ipoh in Malaysia ahead of schedule (targeted for completion in the third quarter of this year).
In the short term, due to the active stocking of large manufacturers and the effect of agents picking up goods, the increase in silicon wafer prices in the second quarter is inevitable. However, with the next 2-3 months, the production capacity of silicon wafer manufacturers will gradually return to the pre-earthquake level, while the major semiconductor manufacturers in Taiwan still have 1.5 to 2 months of inventory at the end of the first quarter, so the supply and demand situation of silicon wafers may be Slow down.
However, compared with silicon wafers, the smooth availability of BT resin has become another focus of the market. There is a possibility of shortage of BT resin for the carrier board. At present, about 90% of BT resins in the world come from Hitachi Chemical and Mitsubishi Gas Chemical. Although the two companies have announced a timetable for resumption of work, Hitachi will resume 80% of its capacity supply before mid-April; Mitsubishi expects to resume 50% of production capacity by the end of April. At the beginning of May, BT resin materials will resume production before the earthquake. ability. However, due to supply constraints, the actual supply of raw materials is uncertain. At present, the company's BT resin stocks, including Xinxing, Riyueguang, Jingshuo, etc., are about one month old.
Although the two major BT suppliers are currently claiming capacity recovery, they have not achieved delivery yet, and it is not known whether there will be any change in the later period. The tight supply of BT resin will indirectly affect the supply of consumer electronics including smart phones and calculators by affecting PCBs, substrates and packaging.
Due to the disruption of the customer supply chain by strong earthquakes in Japan, the hesitation of certain customers' attitudes to orders has affected the entire semiconductor industry chain to a certain extent, leaving the “aftershocks†of the semiconductor industry chain surviving. The wafer tester Jingyuan inductance was affected by the customer's impact. Orders tend to be conservative, affecting the company's overall demand in the second quarter is not as expected; at the same time LCD driver IC and mobile phone chip design customers face lack of material situation, affecting the company's drive IC and mobile phone chip packaging test business.
In addition, TSMC’s equipment purchased from TEL cannot find other sources of procurement. For TSMC, which has orders for subcontract manufacturing OEMs next year, it will not be able to expand production capacity as scheduled. The impact.
In general, more than 30 devices and 19 materials are required to produce semiconductor chips. As long as one device or one material cannot be supplied, the semiconductor chip cannot be manufactured. The overall share of Japan for semiconductor production equipment is 37%. Judging from the share of each device, Japan has 10 kinds of market monopoly equipment with more than 50% share. From the materials perspective, the overall share of semiconductor materials in Japan exceeds 66%. Semiconductor manufacturers such as the United States, Europe, South Korea, and Taiwan, China use semiconductor production equipment in Japan, which accounts for 37% of the world's total, and semiconductor materials in Japan, which account for more than 66% of the world's share, and produce about 80% of the world's semiconductor chips.
Looking at the aftershocks of the Japanese semiconductor supply chain will also have an impact on the global semiconductor industry. Therefore, it is expected that the global semiconductor growth rate in the second quarter of 2011 will still be lower than expected. However, considering that the electronics industry's industrial chain has a strong self-repair and adjustment, after entering the second quarter, the impact of Japan's earthquake will tend to weaken, and the previously suppressed consumer demand will once again start to promote the industry warming, with Some structural investment opportunities.
Japan Earthquake Pushes Up Chip Revenue Expectations The latest research from IHS iSuppli, a US market research company, shows that due to the supply chain effect caused by the earthquake and tsunami in Japan pushing up the prices of important storage devices, global semiconductor revenue in 2011 will be higher than earlier expected. According to the latest research from IHSiSuppli, the growth rate of semiconductor revenue in 2011 is expected to reach 7%, which is higher than the 5.8% expected in early February. Global semiconductor revenue in 2011 is expected to reach US$325.2 billion, which was previously estimated at US$322.1 billion. The semiconductor revenue forecast for each quarter in 2011 exceeds the previous forecast. The main reason is that the revenue of DRAM (dynamic random access memory) equipment is expected to increase.
According to a recent study by iSuppli, DRAM revenue is expected to increase by 6.6% in 2011, which is expected to decline by 4% year-on-year, before it was expected to decline by 10.6% year-on-year. The expected increase in DRAM revenue was driven by the increase in the average sales price in the first quarter, which was partly due to the disruption of the supply chain caused by the earthquake. (Source: iSuppli) The Japanese earthquake last month caused tight silicon wafers (DRAM shipments fell 1.1% in March and April global shipments), coupled with recent problems with some DRAM makers experiencing 40nm process yield problems. As PC-OEM manufacturers strengthen their stocks, DRAM contract prices continue to rise. In addition, many DRAM makers have begun to shift some of their DRAM production capacity to NAND Flash products, including SAMSUNG, the industry leader, so DRAM prices have risen unavoidably.
Judging from our domestic situation, during the “Twelfth Five-Year Plan†period, the rapid development of China’s economy and the emergence of strategic emerging industries will provide a broader market and innovation space for the accelerated development of the integrated circuit industry, resulting in multiple levels of integrated circuits. Market demand, domestic IC design industry should seize the opportunity of the development of new industries and achieve greater results.
With the advantage of the world's largest electronics manufacturing industry, China’s share of global semiconductor consumption continues to grow, but the level of semiconductor product design and production in China still lags behind the world’s advanced level. The state has given a series of supportive policies from the level of policy support. For example, the new document No. 18 issued at the beginning of the year clearly stipulates the tax concessions and property protection of IC design companies. At the same time, the domestic IC design companies can better understand the local customers, so they can better complete the customer's local customization requirements. The response speed has obvious advantages, and the domestic IC design companies have a broad development space.
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