The growth of the semiconductor industry has slowed down this year. Under the Evergrande trend, the market share of TSMC and ASE will be expected to further increase. The growth will exceed that of its peers, and the semiconductor market will continue to show a strong and weak trend.
Slow recovery in Europe, the United States, and Japan. Emerging markets are facing inflation issues. Coupled with the European debt crisis, the impact on terminal demand is less than expected. The semiconductor market inventory levels are rising, leaving the industry expectation of the second half of the year and the effect of the peak season. slow.
The foundry leader Taiwan Semiconductor Manufacturing Co., chairman and chief executive officer Zhang Zhongmou estimated that the output value of the global semiconductor industry in dollars this year will grow by only 5%, far lower than last year's 31%; wafer-generation industrial output value will grow by 12%, It will also be 43% lower than last year.
As the industry growth slows down, the trend of the big market players is obvious. TSMC and Brightsun, the leading manufacturer of packaging and testing, are optimistic that this year's market share is expected to further expand. The growth of the business will continue to surpass its peers.
Zhang Zhongmou has stated on many occasions that he is confident that the company will achieve its internal operational goals this year. TSMC’s revenue in US dollars this year will grow by 20%, which will be higher than the 12% of foundry industry.
TSMC’s consolidated revenue for the first five months of this year was NT$179.212 billion, an annual increase of 11.44%. The growth rate of the company was significantly higher than the world’s advanced level of 4.99% and 2.08% of UMC.
If TSMC’s 20% growth in its performance this year can be successfully achieved, based on a 47.1% market share of TSMC last year, this year, of the 12% growth in the global industrial output value of wafers, at least 9.42% of the growth rate was contributed by TSMC. The average growth rate of the remaining foundries will be only 2.58%.
In the semiconductor packaging and testing industry, Wu Tianyu, the chief operating officer of Sun Moonlight, is equally confident that with the advantages of copper processes, advanced technology and low-footprint packaging, the company’s performance growth this year will surpass its rival by more than 10 percentage points.
Wu Tianyu pointed out that the annual growth rate of Sun Moonlight's performance in the second half of the year will be similar to that in the first half of the year; that is, Sun Moonlight's overall performance this year will grow by about 13% from last year.
In the first five months of this year, the combined monthly revenue of the company was 77.548 billion yuan, an increase of 14.53% year-on-year; on the other hand, the counter-revenue merger in May was 24.14 billion yuan, which was a 9.4% decline from the same period of last year. The performance of Sun Moonlight's operations was significantly better than its peers.
If Sun Moonlight's operational goals can be successfully achieved, the remaining packaging and testing plants will grow at a maximum of only 3% this year.
Both TSMC and ASE are expected to have multiple levels of performance this year. The semiconductor foundry and packaging and testing industry will continue to show strong and weak performance.
Slow recovery in Europe, the United States, and Japan. Emerging markets are facing inflation issues. Coupled with the European debt crisis, the impact on terminal demand is less than expected. The semiconductor market inventory levels are rising, leaving the industry expectation of the second half of the year and the effect of the peak season. slow.
The foundry leader Taiwan Semiconductor Manufacturing Co., chairman and chief executive officer Zhang Zhongmou estimated that the output value of the global semiconductor industry in dollars this year will grow by only 5%, far lower than last year's 31%; wafer-generation industrial output value will grow by 12%, It will also be 43% lower than last year.
As the industry growth slows down, the trend of the big market players is obvious. TSMC and Brightsun, the leading manufacturer of packaging and testing, are optimistic that this year's market share is expected to further expand. The growth of the business will continue to surpass its peers.
Zhang Zhongmou has stated on many occasions that he is confident that the company will achieve its internal operational goals this year. TSMC’s revenue in US dollars this year will grow by 20%, which will be higher than the 12% of foundry industry.
TSMC’s consolidated revenue for the first five months of this year was NT$179.212 billion, an annual increase of 11.44%. The growth rate of the company was significantly higher than the world’s advanced level of 4.99% and 2.08% of UMC.
If TSMC’s 20% growth in its performance this year can be successfully achieved, based on a 47.1% market share of TSMC last year, this year, of the 12% growth in the global industrial output value of wafers, at least 9.42% of the growth rate was contributed by TSMC. The average growth rate of the remaining foundries will be only 2.58%.
In the semiconductor packaging and testing industry, Wu Tianyu, the chief operating officer of Sun Moonlight, is equally confident that with the advantages of copper processes, advanced technology and low-footprint packaging, the company’s performance growth this year will surpass its rival by more than 10 percentage points.
Wu Tianyu pointed out that the annual growth rate of Sun Moonlight's performance in the second half of the year will be similar to that in the first half of the year; that is, Sun Moonlight's overall performance this year will grow by about 13% from last year.
In the first five months of this year, the combined monthly revenue of the company was 77.548 billion yuan, an increase of 14.53% year-on-year; on the other hand, the counter-revenue merger in May was 24.14 billion yuan, which was a 9.4% decline from the same period of last year. The performance of Sun Moonlight's operations was significantly better than its peers.
If Sun Moonlight's operational goals can be successfully achieved, the remaining packaging and testing plants will grow at a maximum of only 3% this year.
Both TSMC and ASE are expected to have multiple levels of performance this year. The semiconductor foundry and packaging and testing industry will continue to show strong and weak performance.
Specifications
1.Steel Processed Reel
2.In accordance with GB4004-83, JB/T7600.3-94 and DlN46395 standards
- choice of flange with or without ribs
- extra stiffeners in the drum
- painting
- hot galvanizing
- stainless steel version
- dynamic balancing
Serial Number |
Specification Model
|
Lateral Plate Diameter D1
|
Major Diameter D2
|
Axle Hole Diameter D4
|
Carrying Hole Diameter D5
|
Center Distance E of Axle Hole and Carrying Hole
|
External Width L1
|
Internal Width L2
|
1
|
315
|
315
|
120
|
33.5
|
16
|
86
|
238
|
200
|
2
|
400
|
400
|
160/200
|
56
|
16
|
71-112
|
300
|
250
|
3
|
440
|
440
|
220
|
80
|
16-28
|
180
|
316
|
292
|
4
|
450
|
450
|
180/224
|
56
|
16-28
|
71-112
|
335
|
280
|
5
|
500
|
500
|
250
|
56
|
16-28
|
142
|
335
|
315
|
6
|
560
|
560
|
224/280
|
56
|
16-28
|
71-112
|
425
|
355
|
7
|
600
|
600
|
250/300
|
56/60
|
16-28
|
71-112
|
340/3
85 |
300/3
50 |
8
|
630
|
630
|
335
|
80
|
16-32
|
140
|
495
|
450
|
9
|
710
|
710
|
355/400
|
80
|
28-40
|
71-112
|
530
|
450
|
10
|
760
|
760
|
355
|
32.5/54
|
21-35
|
64-115
95-126.5 |
345
315 |
295
280 |
11
|
762
|
762
|
355/400
|
60
|
25-40
|
135
|
360
|
280
|
12
|
787
|
787
|
450
|
127
|
25.4
|
120
|
560
|
485
|
13
|
800
|
800
|
450
|
200
|
28-40
|
135
|
600
|
500
|
14
|
900
|
900
|
380
|
80
|
28-40
|
400
|
764
|
720
|
15
|
1000
|
1000
|
500
|
200
|
28-40
|
320
|
780
|
660
|
Punching Wire Spool, Pressed Steel Spool, Single Wall Reel, Pressed Bobbin
NINGBO BEILUN TIAOYUE MACHINE CO., LTD. , http://www.spool-manufacturer.com